Organic light emitting diode display panel and organic light emitting diode display device having the same

ABSTRACT

An organic light emitting diode display panel includes data lines arranged in a first direction; gate lines arranged in a second direction to cross the data lines; a driving voltage line arranged in the first direction; a reference voltage line arranged in the first direction; data pads respectively at ends of corresponding ones of the data lines; a driving voltage pad at an end of the driving voltage line; and a reference voltage pad at an end of the reference voltage line. A first distance is defined between the driving voltage pad and an adjacent data pad, a second distance is defined between adjacent ones of the data pads, and a third distance is defined between the reference voltage pad and an adjacent data pad. At least two of the first distance, the second distance, and the third distance are different from each other.

This application is a Divisional of U.S. patent application Ser. No.15/162,820, filed May 24, 2016, which claims the benefit under 35 U.S.C.§119(a) of Korean Patent Application No. 10-2015-0191852, filed on Dec.31, 2015, both of which are hereby incorporated by reference for allpurposes as if fully set forth herein.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to an organic light emitting diode displaypanel and an organic light emitting diode display device having thesame.

Description of the Related Art

Recently, organic electroluminescent display devices have come into thespotlight. An organic electroluminescent display device uses an organiclight emitting diode (OLED) that emits light itself. Thus, an organicelectroluminescent display device has a number of advantages, such ashigh response speed, high light emitting efficiency, high luminance, awide viewing angle, and the like.

An organic light emitting diode display device has pixels—each includingat least one organic light emitting diode—disposed in a matrix form. Theorganic light emitting diode display device controls the brightness ofthe pixels, which are selected by a scan signal, according to thegradation of data. Each pixel of the organic light emitting diodedisplay device has a pixel structure in which an organic light emittingdiode, a driving transistor for driving the organic light emittingdiode, a storage capacitor, and the like are connected to various signallines.

A pixel structure in the related art requires a reference voltage linefor initializing a source node (or a drain node) of a drivingtransistor. Thus, the reference voltage line is formed in a displaypanel for each pixel and is directly connected to each data drivingintegrated circuit.

A data driving integrated circuit generates a data signal synchronizedwith a scan signal, and supplies the generated data signal to a dataline. To this end, the data driving integrated circuit is electricallyconnected to a data pad portion through the medium of an anisotropicconductive film (ACF) according to a tape automated bonding (TAB)scheme. Also, a pad electrode of the data pad portion is electricallyconnected to a terminal of the data driving integrated circuit through aconductive ball in the ACF.

At this time, a plurality of signal lines connected to the data drivingintegrated circuit and pad electrodes connected to the plurality ofsignal lines are disposed at identical distances. Thus, a line defect(LD), such as a short-circuit and the like, may be caused whenconductive balls gather together or a minute foreign substance permeatesthe device.

Also, it is impossible to inspect the elements for LDs in anon-compensation state and it is difficult to detect the LDs, and theLDs become a factor that results in further lost costs associated withadditionally attached materials when a complete product is manufactured.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to an organic lightemitting diode display panel and organic light emitting diode displaydevice having the same that substantially obviates one or more of theproblems due to limitations and disadvantages of the related art.

An object of the present invention is to provide an organic lightemitting diode display panel that has reduced occurrences of linedefects.

Another object of the present invention is to provide an organic lightemitting diode display panel in which line defects can be more readilydetected during an inspection.

Another object of the present invention is to provide an organic lightemitting diode display panel having improved yield and reduced cost.

Additional features and advantages of the invention will be set forth inthe description which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention. Theobjectives and other advantages of the invention will be realized andattained by the structure particularly pointed out in the writtendescription and claims hereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described, an organiclight emitting diode display panel comprises a plurality of data linesarranged in a first direction; a plurality of gate lines arranged in asecond direction to cross the data lines, a plurality of pixel areasbeing defined by the crossed data lines and gate lines; at least onedriving voltage line arranged in the first direction; at least onereference voltage line arranged in the first direction; a plurality ofdata pads respectively disposed at ends of corresponding ones of thedata lines; a driving voltage pad disposed at an end of the drivingvoltage line; and a reference voltage pad disposed at an end of thereference voltage line; wherein a first distance is defined between thedriving voltage pad and an adjacent data pad, a second distance isdefined between adjacent ones of the data pads, and a third distance isdefined between the reference voltage pad and an adjacent data pad, andwherein at least two of the first distance, the second distance, and thethird distance are different from each other.

In another aspect, an organic light emitting diode display panelcomprises a plurality of data lines arranged in a first direction; aplurality of gate lines arranged in a second direction to cross the datalines, a plurality of pixel areas being defined by the crossed datalines and gate lines; at least one driving voltage line arranged in thefirst direction; at least one reference voltage line arranged in thefirst direction; a plurality of data pads respectively disposed at endsof corresponding ones of the data lines; a driving voltage pad disposedat an end of the driving voltage line; and a reference voltage paddisposed at an end of the reference voltage line, wherein each of thedata pads, the driving voltage pad, and the reference voltage pad aredisposed in a non-active area of the display panel adjacent to an edgeof the display panel, wherein a first distance from the edge of thedisplay panel to the data pads is different than a second distance fromthe edge of the display panel to the driving voltage pad, and whereinthe first distance from the edge of the display panel to the data padsis different than a third distance from the edge of the display panel tothe driving voltage pad.

In another aspect, an organic light emitting diode display devicecomprises a display panel including: a plurality of data lines arrangedin a first direction, a plurality of gate lines arranged in a seconddirection to cross the data lines, a plurality of pixel areas beingdefined by the crossed data lines and gate lines, at least one drivingvoltage line arranged in the first direction, at least one referencevoltage line arranged in the first direction, a plurality of data padsrespectively disposed at ends of corresponding ones of the data lines, adriving voltage pad disposed at an end of the driving voltage line, anda reference voltage pad disposed at an end of the reference voltageline; and an integrated circuit attached to the display panel, theintegrated circuit having a plurality of terminals each connected to arespective one of the data pads, the driving voltage pad, and thereference voltage pad, wherein a first distance is defined between thedriving voltage pad and an adjacent data pad, a second distance isdefined between adjacent ones of the data pads, and a third distance isdefined between the reference voltage pad and an adjacent data pad, andwherein at least two of the first distance, the second distance, and thethird distance are different from each other.

In another aspect, an organic light emitting diode display devicecomprises a display panel including: a plurality of data lines arrangedin a first direction, a plurality of gate lines arranged in a seconddirection to cross the data lines, a plurality of pixel areas beingdefined by the crossed data lines and gate lines, at least one drivingvoltage line arranged in the first direction, at least one referencevoltage line arranged in the first direction, a plurality of data padsrespectively disposed at ends of corresponding ones of the data lines, adriving voltage pad disposed at an end of the driving voltage line, anda reference voltage pad disposed at an end of the reference voltageline; and an integrated circuit attached to the display panel, theintegrated circuit having a plurality of terminals each connected to arespective one of the data pads, the driving voltage pad, and thereference voltage pad, wherein each of the data pads, the driving pad,and the reference voltage pad are disposed in a non-active area of thedisplay panel adjacent to an end of the display panel, wherein a firstdistance from the edge of the display panel to the data pads isdifferent than a second distance from the edge of the display panel tothe driving voltage pad, and wherein the first distance from the edge ofthe display panel to the data pads is different than a third distancefrom the edge of the display panel to the driving voltage pad.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention andtogether with the description serve to explain the principles of theinvention. In the drawings:

FIG. 1 is a view illustrating a schematic system configuration of anorganic light emitting diode display device according to exampleembodiments of the present invention;

FIG. 2 is a view schematically illustrating a structure of an organiclight emitting diode display panel according to example embodiments ofthe present invention;

FIG. 3 is a view illustrating an example of a pixel structure of thedisplay panel illustrated in FIG. 2;

FIG. 4 is a view for explaining an integrated circuit bonding partaccording to a first example embodiment of the present invention;

FIG. 5 is a view illustrating a structure of a cross-section taken alongthe line I-I′ of FIG. 4;

FIG. 6 is a view illustrating a state of attaching an integrated circuitto the integrated circuit bonding part illustrated in FIG. 5;

FIG. 7 is a view for explaining an integrated circuit bonding partaccording to a comparative example;

FIG. 8 is a view illustrating a structure of a cross-section taken alongline II-II′ of FIG. 7;

FIG. 9 is a view illustrating a state of occurrence of failure in theintegrated circuit bonding part illustrated in FIG. 7;

FIG. 10 is a view illustrating a state of attaching an integratedcircuit to the integrated circuit bonding part illustrated in FIG. 8;

FIG. 11 is a view for explaining an integrated circuit bonding partaccording to a second example embodiment of the present invention; and

FIG. 12 is a view illustrating a state in which a foreign substancepermeates into the integrated circuit bonding part illustrated in FIG.11.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Hereinafter, reference will be made in detail to embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings. In designating elements of the drawings by reference numerals,the same elements will be designated by the same reference numeralsalthough they are shown in different drawings. Further, in the followingdescription of the present invention, a detailed description of knownfunctions and configurations incorporated herein will be omitted when itmay make the subject matter of the present invention rather unclear.

In addition, terms, such as first, second, A, B, (a), (b) or the likemay be used herein when describing components of the present invention.Each of these terminologies is not used to define an essence, order orsequence of a corresponding component but used merely to distinguish thecorresponding component from other component(s). In the case that it isdescribed that a certain structural element “is connected to”, “iscoupled to”, or “is in contact with” another structural element, itshould be interpreted that another structural element may “be connectedto”, “be coupled to”, or “be in contact with” the structural elements aswell as that the certain structural element is directly connected to oris in direct contact with another structural element.

FIG. 1 is a view illustrating a schematic system configuration of anorganic light emitting diode display device according to exampleembodiments of the present invention.

As shown in FIG. 1, the organic light emitting diode display device 100may include a display panel 110, a data driver 120, a first gate driver130, a second gate driver 140, a timing controller 150, and a referencevoltage supplier 160. The display panel 110 has a plurality of datalines DL, a plurality of first gate lines GL1, and a plurality of secondgate lines GL2 that are formed therein to define a plurality of pixels.The data driver 120 drives the plurality of data lines DL formed in onedirection in the display panel 110. The first gate driver 130 supplies ascan signal through the first gate lines GL1 disposed in a differentdirection so as to intersect the data lines DL in the display panel 110.The second gate driver 140 supplies a sense signal through the secondgate lines GL2 formed in parallel with the first gate lines GL1 in thedisplay panel 110. The timing controller 150 controls a driving timingof each of the data driver 120, the first gate driver 130, and thesecond gate driver 140. The reference voltage supplier 160 suppliesvarious voltages, for example, a reference voltage Vref which is acommon voltage, to the respective pixels.

The organic light emitting diode display panel 110 includes a pluralityof signal lines, and an integrated circuit bonding part to which anintegrated circuit connected to the plurality of signal lines to supplya signal to the plurality of signal lines is bonded, as described below.In the present example, the integrated circuit bonding part may includea plurality of lower pad electrodes that are connected to the pluralityof signal lines; and a plurality of upper pad electrodes that areconnected to the respective plurality of lower pad electrodes throughcontact holes, and are disposed such that at least one of a distance, alength, and a location is differently applied on an identical plane.

Also, the data driver 120 may include a plurality of data drivingintegrated circuits (which are also referred to as “source drivingintegrated circuits”). The plurality of data driving integrated circuitsmay be connected to a bonding pad of the display panel 110 according toa TAB scheme or a chip-on-glass (COG) scheme, or may be implemented in agate-in-panel (GIP) type and may be directly formed in the display panel110. Alternatively, the data driver 120 may be integrated into thedisplay panel 110.

The first gate driver 130 and the second gate driver 140 may beseparately implemented, or may be included in one gate driver in somecases. The first gate lines GL1 and the second gate lines GL2 may shareone gate line GL, and may supply a sense signal and a scan signalthrough the one gate line GL.

Also, according to a driving type, the first gate driver 130 may bedisposed at only one side of the display panel 110 as illustrated inFIG. 1, or the first gate driver 130 may be divided into two parts andthe two parts may be disposed at both sides of the display panel 110.The second gate driver 140 may be disposed as in the case of the firstgate driver 130.

Further, each of the first gate driver 130 and the second gate driver140 may include a plurality of gate driving integrated circuits. Theplurality of gate driving integrated circuits may be connected to abonding pad of the display panel 110 according to the TAB scheme or theCOG scheme, or may be implemented in a gate-in-panel (GIP) type and maybe directly formed in the display panel 110. Alternatively, the firstgate driver 130 and the second gate driver 140 may be integrated intothe display panel 110. The reference voltage supplier 160 may beconnected to the data driving integrated circuits D-IC of the datadriver 120, and may supply a reference voltage Vref to a referencevoltage line RVL, that is formed in the display panel 110, through thedata driving integrated circuits D-IC.

Hereinafter, with reference to FIG. 2, a description will be made of astructure of the display panel 110 of the organic light emitting diodedisplay device 100 according to an example embodiment of the presentinvention. FIG. 2 is a view schematically illustrating a structure of anorganic light emitting diode display panel according to exampleembodiments of the present invention.

The display panel 200 may include an active area 202, which displays animage, and a non-active area 204 corresponding to a remaining areaexcept for the active area 202. The active area 202 may include aplurality of first gate lines GL1 to GLm and a plurality of data linesDL1 to DLn that are formed at predetermined distances intersecting eachother, and a plurality of pixels P respectively defined by intersectionsbetween the plurality of first gate lines GL1 to GLm and the pluralityof data lines DL1 to DLn.

A pixel P includes a first transistor T1 connected to one first gateline GL1 and one data line DL. The pixel P displays an imagecorresponding to a data signal supplied from the data line DL through asecond transistor T2. For example, the pixel P may become alight-emitting cell that displays an image such that an OLED emits lightaccording to a current corresponding to a data signal supplied from thedata line DL through the second transistor T2.

The pixel P includes a third transistor T3 that is connected to onesecond gate line GL2 and one reference voltage line RVL. A referencevoltage Vref supplied from the reference voltage line RVL is supplied toone of a source or a drain of the second transistor T2 through the thirdtransistor T3, and a characteristic value (e.g., a threshold voltage ormobility) of the second transistor T2 may be sensed through thereference voltage line RVL.

The non-active area 204 may include an integrated circuit bonding part220, to which a driving integrated circuit 210 is bonded in order to notonly supply a scan signal to the first gate lines GL1 to GLm, but alsoto supply a data signal synchronized with the scan signal to the datasignal lines DL1 to DLn. The driving integrated circuit 210 may supply ascan signal and a data signal to display an image on the display panel200 on the basis of driving power, a synchronization signal, and imagedata which are received from a flexible printed circuit 230.

FIG. 3 is a view illustrating an example of a pixel structure of thedisplay panel illustrated in FIG. 2.

As shown in FIG. 3, the display panel 200 may include vertical signallines that include a plurality of data lines DL, a plurality of drivingvoltage lines DVL, and a reference voltage line RVL; and horizontalsignal lines that include first gate lines GL1 and second gate linesGL2.

Also, the display panel 200 may be divided by the vertical signal lines,and may include a pixel P1 connected to a (4 n-3)-th data line DL4 n-3,a pixel P2 connected to a (4 n-2)-th data line DL4 n-2, a pixel P3connected to a (4 n-1)-th data line DL4 n-1, and a pixel P4 connected toa 4 n-th data line DL4 n.

In the present example, a reference voltage line RVL that supplies areference voltage Vref may be disposed to correspond to a plurality ofcolumns of pixels for every column of pixels. For example, a referencevoltage line RVL may be disposed to correspond to four pixels P1 to P4.Further, (2 n-1)-th and 2 n-th driving voltage lines DVL2 n-1 and DVL2 nthat supply a driving voltage VDD may be disposed on both sides of thefour pixels P1 to P4.

The structure of the display panel 200 illustrated as an example in FIG.3 may be a structure suitable for being applied to a display panelhaving pixels patterned in red, green, blue, and white (RGBW).Specifically, the pixels P1 to P4 may be RGBW pixels, but are notlimited thereto.

FIG. 4 is a view for explaining an integrated circuit bonding partaccording to a first example embodiment of the present invention. FIG. 5is a view illustrating a structure of a cross-section taken along theline I-I′ of FIG. 4.

With reference to FIG. 4, the integrated circuit bonding part 410 mayhave, disposed therein, a plurality of data lines 422, 424, 426, and428, a plurality of driving voltage lines 432 and 434, and a referencevoltage line 440, that are extended in one direction.

In the present example, the plurality of data lines 422, 424, 426, and428 may be divided into the first to fourth data lines 422, 424, 426,and 428 that deliver data signals to respective RGBW pixels. The firstto fourth data lines 422, 424, 426, and 428 may respectively correspondto the (4 n-3)-th data lines DL4 n-3, the (4 n-2)-th data lines DL4 n-2,the (4 n-1)-th data lines DL4 n-1, and the 4 n-th data lines DL4 n, asillustrated in FIG. 3.

The first data line 422 and the second data line 424 may be disposedbetween the first driving voltage line 432 and the reference voltageline 440. The first driving voltage line 432 may correspond to the (2n-1)-th driving voltage line DVL2 n-1, as illustrated in FIG. 3. Thereference voltage line 440 may correspond to the reference voltage lineRVL, as illustrated in FIG. 3.

The third data line 426 and the fourth data line 428 may be disposedbetween the second driving voltage line 434 and the reference voltageline 440. The second driving voltage line 434 may correspond to the 2n-th driving voltage line DVL2 n.

The integrated circuit bonding part 410 includes a plurality of lowerpad electrodes that are connected to a plurality of signal lines; and aplurality of upper pad electrodes that are connected to the respectivelower pad electrodes through contact holes, and are disposed such thatat least one of a distance, a length, and a location is differentlyapplied on an identical plane. The plurality of upper pad electrodesinclude a plurality of upper data pad electrodes, a plurality of upperdriving voltage pad electrodes, and an upper reference voltage padelectrode that are electrically connected to a plurality of data lines,a plurality of driving voltage lines, and a reference voltage line,respectively.

Specifically, the integrated circuit bonding part 410 may have, disposedtherein, a plurality of data pad portions 452, 454, 456, and 458, aplurality of driving voltage pad portions 462 and 464, and a referencevoltage pad portion 470 that are electrically connected to the pluralityof data lines 422, 424, 426, and 428, the plurality of driving voltagelines 432 and 434, and the reference voltage line 440, respectively.

In the present example, with reference to FIG. 5, the data pad portions456 and 458 may include lower data pad electrodes 532 and 533, datacontact holes 534 and 535, and upper data pad electrodes 536 and 537,that are disposed on a buffer layer 520 and an insulating layer 530 on asubstrate 510.

The lower data pad electrodes 532 and 533 may be electrically connectedto data lines DL that supply data signals. The data contact holes 534and 535 may be formed by removing partial areas of a passivation layer540, which covers the lower data pad electrodes 532 and 533, and mayexpose partial areas of the lower data pad electrodes 532 and 533. Theupper data pad electrodes 536 and 537 are disposed on the passivationlayer 540, and are connected to the lower data pad electrodes 532 and533 through the data contact holes 534 and 535, respectively.

The driving voltage pad portion 464 may include a lower driving voltagepad electrode 552, a driving voltage contact hole 554, and an upperdriving voltage pad electrode 556, that are disposed on the buffer layer520 and the insulating layer 530 on the substrate 510.

The lower driving voltage pad electrode 552 may be electricallyconnected to a driving voltage line DVL that supplies a driving voltage.The driving voltage contact hole 554 may be formed by removing a partialarea of the passivation layer 540 that covers the lower driving voltagepad electrode 552, and may expose a partial area of the lower drivingvoltage pad electrode 552. The upper driving voltage pad electrode 556is disposed on the passivation layer 540, and is connected to the lowerdriving voltage pad electrode 552 through the driving voltage contacthole 554.

The reference voltage pad portion 470 may include a lower referencevoltage pad electrode 562, a reference voltage contact hole 564, and anupper reference voltage pad electrode 566, that are disposed on thebuffer layer 520 and the insulating layer 530 on the substrate 510. Thelower reference voltage pad electrode 562 may be electrically connectedto the reference voltage line RVL that supplies a reference voltageVref. The reference voltage contact hole 564 may be formed by removing apartial area of the passivation layer 540, that covers the lowerreference voltage pad electrode 562, and may expose a partial area ofthe lower reference voltage pad electrode 562. The upper referencevoltage pad electrode 566 is disposed on the passivation layer 540, andis connected to the lower reference voltage pad electrode 562 throughthe reference voltage contact hole 564.

The integrated circuit bonding part 410 may have the plurality of upperdata pad electrodes 536 and 537, the upper driving voltage pad electrode556, and the upper reference voltage pad electrode 566, that aredisposed at different distances on an identical plane.

Specifically, in the integrated circuit bonding part 410, the upperreference voltage pad electrode 566 and the upper data pad electrode 536may be spaced from each other by a first distance W1, the plurality ofupper data pad electrodes 536 and 537 may be spaced from each other by asecond distance W2, and the upper data pad electrode 537 and the upperdriving voltage pad electrode 556 may be spaced from each other by athird distance W3. In the present example, the first distance W1 may belarger than the second distance W2. Also, the third distance W3 may belarger than the first distance W1.

The first distance may be larger by the size of at least one conductiveball than the second distance. For example, the first distance W1 may beset to be larger than the second distance W2 by about 4 μm, which is thesize of one conductive ball. In the present example, the first distanceW1 may be set to be larger by the size of one conductive ball than thesecond distance W2, and can prevent conductive balls, that gathertogether at the upper reference voltage pad electrode 566, andconductive balls, that gather together at the upper data pad electrodes536, from contacting each other.

FIG. 6 is a view illustrating a state of attaching an integrated circuit610 to the integrated circuit bonding part 410 illustrated in FIG. 5.Here, the integrated circuit part 610 includes terminals 615respectively connected to the upper data pad electrodes 536 and 537, theupper driving voltage pad electrode 556, and the upper reference voltagepad electrode 566.

As shown in FIG. 6, in the integrated circuit bonding part 410, adistance between the upper reference voltage pad electrode 566 and theupper data pad electrode 536 is designed to be larger than a distancebetween the upper data pad electrodes 536 and 537 so that failures, suchas short-circuits and the like, can be prevented although conductiveballs 620 gather together when an integrated circuit 610 is attached.

FIG. 7 is a view for explaining an integrated circuit bonding partaccording to a comparative example. FIG. 8 is a view illustrating astructure of a cross-section taken along line II-II′ of FIG. 7.

In FIGS. 7 and 8, a structure of the integrated circuit bonding partaccording to a comparative example may be identical to the structure ofthe integrated circuit bonding part according to an example embodimentof the present invention as described above with reference to FIG. 4 toFIG. 6. Meanwhile, the integrated circuit bonding part according to acomparative example has a plurality of upper data pad electrodes 812 and813, an upper driving voltage pad electrode 822, and an upper referencevoltage pad electrode 832, that are spaced from each other by equaldistances W4 on an identical plane.

For example, the integrated circuit bonding part according to acomparative example has the upper data pad electrodes 812 and 813, theupper driving voltage pad electrode 822, and the upper reference voltagepad electrode 832, that are spaced from each other by the equaldistances W4.

FIG. 9 is a view illustrating a state of occurrence of failure in theintegrated circuit bonding part illustrated in FIG. 7. FIG. 10 is a viewillustrating a state of attaching an integrated circuit to theintegrated circuit bonding part illustrated in FIG. 8.

With reference to FIGS. 9 and 10, in the integrated circuit bonding partaccording to a comparative example of the present invention, it may beconfirmed that conductive balls 920 gather together or a minute foreignsubstance 930 permeates and thus, a short-circuit occurs between areference voltage pad electrode 832 and a data pad electrode 812, sothat failure occurs.

FIG. 11 is a view for explaining an integrated circuit bonding partaccording to a second example embodiment of the present invention.

As shown in FIG. 11, the integrated circuit bonding part 1110 accordingto the second example embodiment of the present invention may have,disposed therein, a plurality of data lines 1122, 1124, 1126, and 1128,a plurality of driving voltage lines 1132 and 1134, and a referencevoltage line 1140, that are extended in one direction. In the presentexample, the plurality of data lines 1122, 1124, 1126, and 1128 may bedivided into first to fourth data lines 1122, 1124, 1126, and 1128 thatdeliver data signals to respective RGBW pixels. The first data line 1122and the second data line 1124 may be disposed between the first drivingvoltage line 1132 and the reference voltage line 1140. The third dataline 1126 and the fourth data line 1128 may be disposed between thesecond driving voltage line 1134 and the reference voltage line 1140.

Also, the integrated circuit bonding part 1110 may have, disposedtherein, a plurality of data pad electrodes 1152, 1154, 1156, and 1158,a plurality of driving voltage pad electrodes 1162 and 1164, and areference voltage pad electrode 1170, that are electrically connected tothe plurality of data lines 1122, 1124, 1126, and 1128, the plurality ofdriving voltage lines 1132 and 1134, and the reference voltage line1140, respectively.

In the present example, the plurality of data pad electrodes 1152, 1154,1156, and 1158, the plurality of driving voltage pad electrodes 1162 and1164, and the reference voltage pad electrode 1170 may have respectivepad electrodes that are formed therein with different lengths, or aredisposed at different locations with a lengthwise direction as areference. The plurality of data pad electrodes 1152, 1154, 1156, and1158, the plurality of driving voltage pad electrodes 1162 and 1164, andthe reference voltage pad electrode 1170 may have the respective padelectrodes that are disposed such that at least one of a length and alocation is differently applied to the pad electrodes on an identicalplane, as described below.

Lengths of the driving voltage pad electrodes 1162 and 1164 may bedifferent from one of those of the plurality of data pad electrodes1152, 1154, 1156, and 1158, and that of the reference voltage padelectrode 1170. For example, as illustrated in FIG. 11, the plurality ofdata pad electrodes 1152, 1154, 1156, and 1158, and the referencevoltage pad electrode 1170 all have a first length L1, and the drivingvoltage pad electrodes 1162 and 1164 both have a second length L2. Inthe present example, the first length L1 may be shorter than the secondlength L2. Also, the plurality of data pad electrodes 1152, 1154, 1156,and 1158, and the reference voltage pad electrode 1170 may be disposedat different locations with the lengthwise direction as a reference.

Specifically, the driving voltage pad electrodes 1162 and 1164 may beformed to be longer than the plurality of data pad electrodes 1152,1154, 1156, and 1158, and the reference voltage pad electrode 1170. Forexample, the driving voltage pad electrodes 1162 and 1164 may be formedto be twice longer than the plurality of data pad electrodes 1152, 1154,1156, and 1158, and the reference voltage pad electrode 1170. Here, thefirst and second driving voltage lines 1132 and 1134 may carry highercurrents, and therefore, the driving voltage pad electrodes 1162 and1164 may be longer to have better electrical connection and reducedheating.

Also, the plurality of data pad electrodes 1152, 1154, 1156, and 1158,and the reference voltage pad electrode 1170 may be formed to have anidentical length. In this regard, the plurality of data pad electrodes1152, 1154, 1156, and 1158, and the reference voltage pad electrode 1170may be disposed at different locations with the lengthwise direction asa reference. For example, the reference voltage line 1140 may beextended to be longer than the data lines 1122, 1124, 1126, and 1128,and the reference voltage pad electrode 1170 may be disposed at alocation which is more distant than those of the plurality of data padelectrodes 1152, 1154, 1156, and 1158 with the lengthwise direction as areference.

As another example, the plurality of data pad electrodes 1152, 1154,1156, and 1158, and the reference voltage pad electrode 1170 may beformed with different lengths. In this regard, the plurality of data padelectrodes 1152, 1154, 1156, and 1158, and the reference voltage padelectrode 1170 may be disposed at different locations with thelengthwise direction as a reference.

FIG. 12 is a view illustrating a state in which a foreign substancepermeates into the integrated circuit bonding part illustrated in FIG.11.

With reference to FIG. 12, in the integrated circuit bonding part 1110,the plurality of data pad electrodes 1152, 1154, 1156, and 1158 may beformed to be shorter than the driving voltage pad electrodes 1162 and1164, and may be disposed at a location different from that of thereference voltage pad electrode 1170. Accordingly, it is possible toensure a sufficiently large space between the driving voltage padelectrodes 1162 and 1164 and the reference voltage pad electrode 1170;and a sufficiently large space between the second data pad electrode1154 and the third data pad electrode 1156 that are adjacent to thereference voltage pad electrode 1170.

Therefore, the integrated circuit bonding part 1110, according to thesecond example embodiment of the present invention, may have theplurality of data pad electrodes 1152, 1154, 1156, and 1158, and thereference voltage pad electrode 1170, that are disposed at differentlocations. Accordingly, even when conductive balls 1220 gather togetheror a minute foreign substance 1230 permeates into the integrated circuitbonding part 1110, it is possible to prevent failure caused by ashort-circuit between the plurality of data pad electrodes 1152, 1154,1156, and 1158, and the reference voltage pad electrode 1170.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the invention. Thus, it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. An organic light emitting diode display panel,comprising: a plurality of data lines arranged in a first direction; aplurality of gate lines arranged in a second direction to cross the datalines, a plurality of pixel areas being defined by the crossed datalines and gate lines; at least one driving voltage line arranged in thefirst direction; at least one reference voltage line arranged in thefirst direction; a plurality of data pads respectively disposed at endsof corresponding ones of the data lines; a driving voltage pad disposedat an end of the driving voltage line; and a reference voltage paddisposed at an end of the reference voltage line, wherein each of thedata pads, the driving voltage pad, and the reference voltage pad aredisposed in a non-active area of the display panel adjacent to an edgeof the display panel, wherein a first distance from the edge of thedisplay panel to the data pads is different than a second distance fromthe edge of the display panel to the driving voltage pad, and whereinthe first distance from the edge of the display panel to the data padsis different than a third distance from the edge of the display panel tothe driving voltage pad.
 2. The organic light emitting diode displaypanel according to claim 1, wherein the second and third distances aresubstantially the same.
 3. The organic light emitting diode displaypanel according to claim 1, wherein a length of the data pad in thefirst direction is substantially the same as a length of the referencevoltage pad in the first direction.
 4. The organic light emitting diodedisplay panel according to claim 1, wherein a length of the drivingvoltage pad in the first direction is greater than a length of the datapad in the first direction.
 5. An organic light emitting diode displaydevice, comprising: a display panel including: a plurality of data linesarranged in a first direction, a plurality of gate lines arranged in asecond direction to cross the data lines, a plurality of pixel areasbeing defined by the crossed data lines and gate lines, at least onedriving voltage line arranged in the first direction, at least onereference voltage line arranged in the first direction, a plurality ofdata pads respectively disposed at ends of corresponding ones of thedata lines, a driving voltage pad disposed at an end of the drivingvoltage line, and a reference voltage pad disposed at an end of thereference voltage line; and an integrated circuit attached to thedisplay panel, the integrated circuit having a plurality of terminalseach connected to a respective one of the data pads, the driving voltagepad, and the reference voltage pad, wherein each of the data pads, thedriving pad, and the reference voltage pad are disposed in a non-activearea of the display panel adjacent to an end of the display panel,wherein a first distance from the edge of the display panel to the datapads is different than a second distance from the edge of the displaypanel to the driving voltage pad, and wherein the first distance fromthe edge of the display panel to the data pads is different than a thirddistance from the edge of the display panel to the driving voltage pad.6. The organic light emitting diode display device according to claim 5,wherein at least one conductive ball is between each terminal and theone of the data pads, the driving voltage pad, and the reference voltagepad to which the terminal is connected.
 7. The organic light emittingdiode display device according to claim 5, wherein the second and thirddistances are substantially the same.
 8. The organic light emittingdiode display device according to claim 5, wherein a length of the datapad in the first direction is substantially the same as a length of thereference voltage pad in the first direction.
 9. The organic lightemitting diode display device according to claim 5, wherein a length ofthe driving voltage pad in the first direction is greater than a lengthof the data pad in the first direction.